Tender Overview
Indian Institute of Technology Bhilai has invited bids for Supply and Installation of Wire Bonder at IIT Bhilai in the Laboratory and scientific equipment sector, located at IIT BHILAI.
Key Tender Details
| Tender ID | ITBH/GOODS/PHY/2025-26/675 |
| Issuing Authority | Indian Institute of Technology Bhilai |
| Organisation Type | Central Govt. Ministry/Department |
| Location | IIT BHILAI |
| Tender Type | Open/Advertised |
| Category | Goods |
| Estimated Value | ₹As per tender document |
| EMD Amount | ₹105000 |
| Document Fee | ₹1500 |
| Published Date | 10-Dec-2025 06:00 PM |
| Submission Last Date | 30-Dec-2025 03:00 PM |
| Bid Opening Date | 31-Dec-2025 03:30 PM |
Scope of Work
Supply and Installation of Wire Bonder at IIT Bhilai
How to Apply
Interested and eligible bidders must submit their bids through the official e-procurement portal before the last date of submission. For detailed terms, conditions, eligibility criteria, and bidding process, please refer to the tender documents available at the link below.
📄 View Full Tender Details & Download Documents
Important Dates
- Published: 10-Dec-2025 06:00 PM
- Submission Deadline: 30-Dec-2025 03:00 PM
- Bid Opening: 31-Dec-2025 03:30 PM
Disclaimer
The information provided above is based on the details available from the official tender portal at the time of publication. Bidders are advised to verify all information and refer to the original tender document and corrigenda (if any) before submitting bids.
