Explore the Delhi Government Tender for 3 inch InGaAs-InP PiN Wafers
The Delhi government tender for 3 inch InGaAs-InP PiN Wafers is now open for bids. Organized by the Department of Defence Research and Development, this tender provides a significant opportunity for suppliers in the semiconductor industry.
Key Highlights of the Tender
- Organization: Department of Defence Research and Development
- Location: SSPL, Delhi
- Estimated Value: Not specified
- EMD: ₹195,400
- Document Fee: ₹0
- Tender Type: Global Tenders
Eligibility and Requirements
Potential bidders must ensure compliance with all eligibility criteria outlined in the tender documents. The focus is on companies experienced in manufacturing and supplying semiconductor wafers.
How to Apply
Interested parties can apply by following these steps:
- Visit the official tender portal at this link.
- Download the tender documents.
- Prepare the bid as per the guidelines provided.
- Submit the bid by the due date, ensuring all documents are complete.
Important Dates
| Submission Date | 23-Feb-2026 02:00 PM |
| Opening Date | 24-Feb-2026 02:30 PM |
| Published Date | 05-Jan-2026 05:00 PM |
Frequently Asked Questions
- What is the EMD amount?
The EMD amount is ₹195,400. - Where can I download the tender documents?
Documents can be downloaded from the official tender portal. - What is the submission deadline?
The submission deadline is 23-Feb-2026 by 02:00 PM.
Apply now to participate in this significant opportunity for the supply of 3 inch InGaAs-InP PiN Wafers in Delhi.
